Samsung, SK Hynix Among 180 Semiconductor Companies Converge in Suwon... Advanced Packaging Industry Exhibition Opens
One hundred eighty semiconductor companies, including Samsung Electronics and SK Hynix, are gathering in Suwon to showcase advanced packaging technologies.
The aim is to bring together the latest trends in back-end process technology that determines the competitiveness of artificial intelligence (AI) semiconductors and broaden technical exchanges between companies and experts.
According to Suwon City on the 26th, the '2026 Next-Generation Semiconductor Packaging Industry Exhibition (ASPS)' opened on that day at Suwon Convention Center. Co-hosted by the city and Gyeonggi Province, it runs for four days through the 28th.
Packaging is a critical back-end process technology that connects and integrates semiconductor chips at high density to enhance performance and power efficiency. As semiconductor fine-process technology approaches its limits, how chips are stacked and connected has become decisive for performance, which is why it is receiving attention as a core technology to lead the AI semiconductor era.
One hundred eighty companies will operate 400 booths at the exhibition, displaying related advanced technologies including semiconductor packaging and testing process equipment, materials, components, and technical solutions. In addition to the industrial exhibition, semiconductor packaging forums, procurement consultation sessions, job fairs, and company-specific technical seminars will be held over the four days.
The International Semiconductor Executive Summit (ISIG Executive Summit Korea), attended by global semiconductor company executives, will also be held during the same period. This is a venue to discuss next-generation semiconductor core technology roadmaps and global collaboration strategies, and held a joint opening ceremony with the industry exhibition.
On the opening day, a semiconductor packaging trends forum was held with the theme 'AI Era, From Chip to System - The Great Transformation of Semiconductor Packaging.' Speakers addressed the direction of innovation in the AI semiconductor packaging value chain.
Professor Freddy Gabbay of Hebrew University in Jerusalem discussed the geopolitics of chiplets and advanced packaging amid AI hegemony competition. Yi Jin-wu, Director of Texas Instruments (TI) Korea, presented the technological fusion of GaN power semiconductors and advanced packaging for AI data center innovation. Lim Yong-woo, Commercial Counselor of the Quebec Government Representative Office in Korea, introduced the Quebec semiconductor ecosystem and cooperation opportunities. Lee Hee-seok, Senior Executive of Samsung Electronics, continued with a presentation on the theme 'Packaging for AI, AI for Packaging.'
The city will also operate a joint pavilion during the exhibition period. Three companies located within the city—Optz Co., Ltd., Methasol Co., Ltd., and MS Technology Co., Ltd.—will showcase their products and technologies at the pavilion. The city will also work to attract businesses by introducing target sites for investment attraction and investment incentives at the joint pavilion.
Detailed information on exhibition programs and participation methods can be found on the official website (www.semipkgshow.com).
Suwon Special City Mayor Lee Jae-jun stated, "This is an era where semiconductor packaging technology determines the competitiveness of AI semiconductors," and added, "I hope this industry exhibition will serve as a solid foundation for innovation and growth in the packaging industry."
He continued, "Suwon City is building an advanced industrial ecosystem centered on semiconductors, AI, and bioscience, where research, demonstration, and startups are organically connected, and is transitioning to an 'advanced science research city.'" He further stated, "We will support technological innovation of small and medium-sized enterprises and lay the foundation for an advanced science research city on the global stage."